Patente
Patent number: 9551066
Abstract: A high-power pulsed magnetron sputtering process, wherein within a process chamber by means of an electrical energy source a sequence of complex discharge pulses is produced by applying an electrical voltage between an anode and a cathode in order to ionize a sputtering gas. The complex discharge pulse is applied for a complex pulse time. The cathode has a target comprising a material to be sputtered for the coating of a substrate, and the complex discharge pulse includes an electrical high-power sputtering pulse having a negative polarity with respect to the anode and being applied for a first pulse-time, the high-power sputtering pulse being followed by an electrical low-power charge cleaning pulse having a positive polarity with respect to the anode and being applied for a second pulse-time. The ratio ?1/?2 of the first pulse-time (?1) in proportion to the second pulse-time (?2) is 0.5 at the most.
Type: Grant
Filed: July 28, 2009
Date of Patent: January 24, 2017
Assignee: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON
Inventors: Jones Alami, Georg Erkens, Jürgen Müller, Jörg Vetter
Patent number: 9551067
Abstract: The invention relates to a coating method for depositing a layer system formed from hard material layers on a substrate, by depositing at least one contact layer including the evaporation material on the surface of the substrate only by means of a cathodic vacuum arc evaporation source. After the depositing of the contact layer, at least one intermediate layer is deposited in the form of a nano-layer intermediate layer in a hybrid phase or as a nanocomposite layer, including the evaporation material and the discharge material, by parallel operation of a cathodic vacuum arc evaporation source and of a magnetron discharge source.
Type: Grant
Filed: April 18, 2013
Date of Patent: January 24, 2017
Assignee: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON
Inventors: Jörg Vetter, Georg Erkens, Jürgen Müller
Patent number: 9728382
Abstract: Evaporation source, in particular for use in a sputtering process or in a vacuum arc evaporation process, preferably a cathode vacuum arc evaporation process. The evaporation source includes an inner base body which is arranged in an outer carrier body and which is arranged with respect to the outer carrier body such that a cooling space in flow communication with an inlet and an outlet is formed between the base body and the carrier body. In accordance with the invention, the cooling space includes an inflow space and an outflow space, and the inflow space is in flow communication with the outflow space via an overflow connection for the cooling of the evaporation source such that a cooling fluid can be conveyed from the inlet via the inflow space the overflow connection and the outflow space to the outlet.
Type: Grant
Filed: January 24, 2014
Date of Patent: August 8, 2017
Assignee: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON
Inventors: Joerg Vetter, Stefan Esser, Juergen Mueller, Georg Erkens
Patent number: 10083822
Abstract: The invention relates to a physical vapor deposition coating device (1), comprising a process chamber (2) with an anode (3) and a consumable cathode (4) to be consumed by an electrical discharge for coating a substrate located within the process chamber (2). The coating device (1) further includes a first electrical energy source (5) being connected with its negative pole to said consumable cathode (4), and a second electrical energy source (6) being connected with its positive pole to said anode (3). According to the invention, a third electrical energy source (7) is provided being connected with its negative pole to a source cathode (8) which is different from the consumable cathode (4). In addition, the invention relates to a physical vapor deposition method for coating a substrate.
Type: Grant
Filed: August 19, 2009
Date of Patent: September 25, 2018
Assignee: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON
Inventors: Jones Alami, Georg Erkens, Tariq Rasa, Jörg Vetter
Patent number: 8470456
Abstract: The invention relates to a layer system for the formation of a surface layer on a surface of a substrate, in particular on the surface of a tool, wherein the layer system includes at least one first hard layer of the composition (MoSipAYq)?(NrCsOt)? with (o+p+q)=?, (r+s+t)=?, and (?+?)=100, wherein 40???60 and wherein M is at least one metal of the group of the chemical elements consisting of Al and the elements of the secondary groups IVb, Vb, VIb of the periodic system of elements. In accordance with the invention the component AY is at least one element of the group of the chemical elements consisting of Mn, Fe, Co, Ni, Cu and the elements of the secondary group IIIB and the elements of the main group IA, IIA and IIIA and the elements of the group of the lanthanoids of the periodic system of chemical elements, with AY preferably additionally containing boron.
Type: Grant
Filed: June 24, 2008
Date of Patent: June 25, 2013
Assignee: Sulzer Metaplas GmbH
Inventors: Jörg Vetter, Georg Erkens
Patent number: 8956722
Abstract: The invention thus relates to a layer system (1) for the formation of a surface layer on a surface of a substrate, in particular on the surface of a tool, in particular on the surface of a shaping tool, wherein the layer system includes at least a first surface layer of the composition (VaMebMcXd)?(NuCvOw)?, where (a+b+c+d)=?, ?=100%, with respect to the atoms Va,Meb,Mc,Xd present in the layer, (u+v+w)=?. ?=100 with respect to the atoms N, C, O present in the layer, with the sum of all the atoms in the layer (?+?)=100 at %, where 40???80 at % applies, and where Meb is at least one element from the group of chemical elements including Zr, Hf, Nb, Ta, Mo, W, Ni, Cu, Sc, Y, La, Ce, Pr, Nd, Pm, Sm of the periodic system of chemical elements and Mc is at least one element of the group of chemical elements including Ti, Cr, and Xd is at least one element from the group of chemical elements including S, Se, Si, B of the periodic system of elements, where 0?u?100, 0?v?100 and 0?w?80.
Type: Grant
Filed: July 2, 2009
Date of Patent: February 17, 2015
Assignee: Oerlikon Metaplas GmbH
Inventors: Joerg Vetter, Georg Erkens
Patent number: 6352627
Abstract: The invention relates to a PVD coating method and to a PVD coating device with a chamber in which at least one target cathode, at least one anode and at least one substrate holder which is intended to hold at least one substrate are arranged, and with a control device which delivers a first voltage in order to supply the target cathode with a negative electrical potential relative to the anode in order to form a plasma in which the substrate is arranged, and which delivers a second voltage in order to supply the anode with a positive electrical potential relative to the chamber wall. In this sputter-coating device, the ion fraction of the target material which can be achieved is too low for qualitatively satisfactory coating properties. It is increased according to the invention in that the control device delivers a third voltage which supplies the substrate with an electrical potential that is more negative than the potential of the anode.
Type: Grant
Filed: October 14, 1999
Date of Patent: March 5, 2002
Assignee: Cemecon-Ceramic Metal Coatings
Inventors: Antonius Leyendecker, Georg Erkens, Stefan Esser, Hans-Gerd Fuss, Bernd Hermeler, Rainer Wenke
Patent number: 6869334
Abstract: The invention relates to a process for producing a hard-material-coated component, comprising the following steps: application of a layer of hard material to the component in a PVD coating unit; and structural further processing of the outer surface of the layer of hard material, and to a component produced using the process. Particularly in the case of thick coatings or coatings with a columnar structure, such processes have a problem producing a sufficiently smooth surface on the coating. The problem is solved by the fact that for the structural further processing, the surface of the layer is blasted in a blasting device in order to improve this surface, an inorganic blasting agent with a grain size in the range from 1 ?m to 100 ?m and a sharp-edged grain shape being used.
Type: Grant
Filed: May 29, 2000
Date of Patent: March 22, 2005
Assignee: Cemecon-Ceramic Metal Coatings-Dr. Ing. Antonius Leyendecker GmbH
Inventors: Antonius Leyendecker, Hans-Gerd Fuss, Rainer Wenke, Georg Erkens, Stefan Esser, Ingo Künzel